The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Sep. 25, 2008
Junichi Nakamura, Suita, JP;
Yasunori Tsujino, Ibaraki, JP;
Kunio Takahashi, Kawanishi, JP;
Ai Matsumoto, Takatsuki, JP;
Masafumi Yamashita, Takatsuki, JP;
Yukihiro Kasano, Suita, JP;
Tatsushi Hirauchi, Takatsuki, JP;
Junichi Nakamura, Suita, JP;
Yasunori Tsujino, Ibaraki, JP;
Kunio Takahashi, Kawanishi, JP;
Ai Matsumoto, Takatsuki, JP;
Masafumi Yamashita, Takatsuki, JP;
Yukihiro Kasano, Suita, JP;
Tatsushi Hirauchi, Takatsuki, JP;
Nippon Skokubai Co., Ltd., Osaka, JP;
Abstract
The present invention provides a curable resin composition which exhibits the following properties: excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.