The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2014

Filed:

Jan. 27, 2006
Applicants:

Shizuo Tomiyasu, Shunan, JP;

Kohichi Tokudome, Shunan, JP;

Kenichi Haga, Shunan, JP;

Inventors:

Shizuo Tomiyasu, Shunan, JP;

Kohichi Tokudome, Shunan, JP;

Kenichi Haga, Shunan, JP;

Assignee:

Tosoh Finechem Corporation, Shunan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 22/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.


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