The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Dec. 27, 2012
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Young Sik Kim, Cheonan-si, KR;
Doo Jin Kim, Cheonan-si, KR;
Sung Bok Hong, Cheonan-si, KR;
Ki Taik Oh, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.