The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8672210 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 18, 2014

Filed:

Dec. 27, 2012
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, KR;

Inventors:

Young Sik Kim, Cheonan-si, KR;

Doo Jin Kim, Cheonan-si, KR;

Sung Bok Hong, Cheonan-si, KR;

Ki Taik Oh, Cheonan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.


Find Patent Forward Citations

Kim, Young. (2014). Capillary exchange system of semiconductor wire bonding (U.S. Patent No. 8672210). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8672210

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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