The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Mar. 12, 2004
Meí MA Chen, Singapore, SG;
Zhongli LI, Singapore, SG;
Chee Yen Lim, Singapore, SG;
Pei Ying Joyce Tan, Singapore, SG;
Minghua Wang, Singapore, SG;
Yuan Xu, Singapore, SG;
Meí Ma Chen, Singapore, SG;
Zhongli Li, Singapore, SG;
Chee Yen Lim, Singapore, SG;
Pei Ying Joyce Tan, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
A microneedle mold and a method of manufacturing a microneedle mold are provided for use in fabricating microneedles. The method includes providing a microneedle mold base with recesses therein, the recesses corresponding to the microneedles to be fabricated and extending from a first surface of the microneedle mold base; and forming side-port forming holes in the microneedle mold base, the side-port forming holes extend in side surfaces of the recesses within the microneedle mold base at side-port forming positions of the recesses.