The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Mar. 15, 2012
Shohei Hata, Yokohama, JP;
Yuichi Oda, Hitachi, JP;
Kazuma Kuroki, Hitachinaka, JP;
Hiromitsu Kuroda, Hitachi, JP;
Shohei Hata, Yokohama, JP;
Yuichi Oda, Hitachi, JP;
Kazuma Kuroki, Hitachinaka, JP;
Hiromitsu Kuroda, Hitachi, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.