The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
May. 31, 2011
Mohammad Tabatabai, Newport Beach, CA (US);
Abbas Amirichimeh, Irvine, CA (US);
Lorenzo Longo, Laguna Beach, CA (US);
Mohammad Tabatabai, Newport Beach, CA (US);
Abbas Amirichimeh, Irvine, CA (US);
Lorenzo Longo, Laguna Beach, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.