The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2014

Filed:

Feb. 22, 2012
Applicants:

Takeaki Saiki, Hiratsuka, JP;

Yoshihito Takei, Hiratsuka, JP;

Inventors:

Takeaki Saiki, Hiratsuka, JP;

Yoshihito Takei, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); C08G 77/08 (2006.01); C08G 77/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst.(RSiO)((R)SiO)((R)SiO)(SiO)(XO)  (1) In this formula, R, R, and Rare identical or differing monovalent organic groups, 'X' is a hydrogen atom or a monovalent organic group, 'a' is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.


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