The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Dec. 03, 2010
Takashi Iwamoto, Urayasu, JP;
Takashi Iwamoto, Urayasu, JP;
Empire Technology Development LLC, Wilmington, DE (US);
Abstract
A wiring substrate with improved heat dissipation capability and with reduced size is disclosed. The wiring substrate includes a metal core substrate, a buffer layer formed so as to cover at least a part of the metal core substrate and containing a phase change material or a material with an electrocaloric effect, an electronic device mounted on a surface of a base including the metal core substrate and the buffer layer or inside the base, and a thermal via formed between the electronic device and the buffer layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile