The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Aug. 09, 2011
Kenji Ikeda, Hitachinaka, JP;
Hisashi Morooka, Hitachinaka, JP;
Motonobu Iizuka, Hitachi, JP;
Yoshihiro Haraguchi, Hitachi, JP;
Naohiro Hiruta, Takahagi, JP;
Shoichi Maruyama, Yamatsuri, JP;
Kenji Ikeda, Hitachinaka, JP;
Hisashi Morooka, Hitachinaka, JP;
Motonobu Iizuka, Hitachi, JP;
Yoshihiro Haraguchi, Hitachi, JP;
Naohiro Hiruta, Takahagi, JP;
Shoichi Maruyama, Yamatsuri, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.