The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Jul. 13, 2012
Akinobu Shibuya, Tokyo, JP;
Koichi Takemura, Tokyo, JP;
Akira Ouchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
Akinobu Shibuya, Tokyo, JP;
Koichi Takemura, Tokyo, JP;
Akira Ouchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A substrate and a semiconductor chip are connected by means of flip-chip interconnection. Around connecting pads of the substrate and input/output terminals of the semiconductor chip, an underfill material is injected. The underfill material is a composite material of filler and resin. Also, a first main surface of the substrate, which is not covered with the underfill material, and the side surfaces of the semiconductor chip are encapsulated with a molding material. The molding material is a composite material of filler and resin. An integrated body of the substrate and the semiconductor chip, which are covered with the molding material, is thinned from above and below.