The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8668862 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 11, 2014

Filed:

May. 06, 2011
Applicants:

Keizou Matsumura, Osaka, JP;

Taishi Maruichi, Hyogo, JP;

Inventors:

Keizou Matsumura, Osaka, JP;

Taishi Maruichi, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/56 (2006.01); B29C 45/73 (2006.01);
U.S. Cl.
CPC ...
Abstract

Flow gatescapable of protruding and retracting are provided in a cavityof a dieto control a resin filling path. The generation of welds or orientation lines in a resin flow pattern is allowed only in an area containing uneven portions outside a design surface but is not allowed in other areas. The area containing welds or orientation lines in a resin flow pattern is covered with a separate component having a design surface, thereby achieving a desired metallic appearance.


Find Patent Forward Citations

Matsumura, Keizou. (2014). Resin molding method, die device, and resin molded article (U.S. Patent No. 8668862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8668862

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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