The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2014

Filed:

Jul. 21, 2010
Applicants:

Takayuki Yamada, Kanagawa, JP;

Kazuaki Tabata, Kanagawa, JP;

Inventors:

Takayuki Yamada, Kanagawa, JP;

Kazuaki Tabata, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.


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