The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8664946 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 04, 2014

Filed:

Feb. 13, 2008
Applicants:

Paulus Martinus Catharina Hesen, Hamburg, DE;

Roelf Anco Jacob Groenhuis, Nijmegen, NL;

Johannes Wilhelmus Dorotheus Bosch, Nijmegen, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.


Find Patent Forward Citations

Hesen, Paulus Martinus Catharina. (2014). Sensor packages including a lead frame and moulding body and methods of manufacturing (U.S. Patent No. 8664946). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8664946

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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