The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Jun. 27, 2012
Chang-hoon Han, Cheonan-si, KR;
Jin-ho Kim, Cheonan-si, KR;
Bo-seong Kim, Asan-si, KR;
Yun-jin OH, Asan-si, KR;
Chang-Hoon Han, Cheonan-si, KR;
Jin-Ho Kim, Cheonan-si, KR;
Bo-Seong Kim, Asan-si, KR;
Yun-Jin Oh, Asan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package includes a first semiconductor chip mounted to a substrate, a first encapsulant covering the first semiconductor chip and have first to fourth sidewall surfaces, and a chip stack mounted to the substrate and disposed on the first encapsulant. The chip stack includes a plurality of second semiconductor chips. A second encapsulant covers the chip stack. The second encapsulant may cover the first sidewall surface of the first encapsulant and expose the third sidewall surface of the first encapsulant.