The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Jan. 25, 2011
Applicant:
Hiroki Yamamoto, Kanagawa, JP;
Inventor:
Hiroki Yamamoto, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a semiconductor chip and a first interconnection tape. The semiconductor chip has a plurality of first electrode pads arranged on a first surface. The first interconnection tape is in contact with each of the plurality of first electrode pads such that the plurality of first electrode pads are electrically connected with each other.
Yamamoto, Hiroki. (2014). Interconnection tape providing a serial electrode pad connection in a semiconductor device (U.S. Patent No. 8664776). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8664776
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile