The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Apr. 30, 2010
Kyoung-min Kim, Seoul, KR;
Kyoung-Min Kim, Seoul, KR;
Wavenics Inc., Daejeon, KR;
Lumens Co., Ltd., Yongin-Si, KR;
Abstract
The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit. The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide layer with a constant width along the circumference of the metal substrate from an opposite side of the metal substrate; forming a plurality of external connection terminals by forming a separation groove by eliminating a circumference portion of the metal substrate, disconnected with a center portion thereof by the insulation groove along the circumference with a predetermined gap; mounting or manufacturing an electronic part on the metal substrate or the oxide layer; and electrically connecting an electrode of the electronic part with the external connection terminal.