The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8664028 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 04, 2014

Filed:

Mar. 09, 2012
Applicants:

Yasuyuki Shibata, Yokohama, JP;

Ji-hao Liang, Kawasaki, JP;

Inventors:

Yasuyuki Shibata, Yokohama, JP;

Ji-Hao Liang, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

(a) On a growth substrate, a void-containing layer that is made of a group III nitride compound semiconductor and contains voids is formed. (b) On the void-containing layer, an n-type layer that is made of an n-type group III nitride compound semiconductor and serves to close the voids is formed. (c) On the n-type layer, an active layer made of a group III nitride compound semiconductor is formed. (d) On the active layer, a p-type layer made of a p-type group III nitride compound semiconductor is formed. (e) A support substrate is bonded above the p-type layer. (f) The growth substrate is peeled off at the boundary where the voids are produced. In the above step (a) or (b), the supply of at least part of the materials that form the layer is decreased, while heating, before the voids are closed.


Find Patent Forward Citations

Shibata, Yasuyuki. (2014). Semiconductor device production process (U.S. Patent No. 8664028). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8664028

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