The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Dec. 30, 2011
Chuan Ling HU, Taipei, TW;
Chen Lung Tsai, Taipei, TW;
Yu Wei Chen, New Taipei, TW;
Chen Hao Chang, Taoyuan County, TW;
Chuan Ling Hu, Taipei, TW;
Chen Lung Tsai, Taipei, TW;
Yu Wei Chen, New Taipei, TW;
Chen Hao Chang, Taoyuan County, TW;
Other;
ICT-Lanto Limited, Fotan Nt, HK;
Abstract
A method of manufacturing plastic metallized 3D circuit includes the steps of providing a 3D plastic main body; performing a surface pretreatment on the plastic main body; performing a metallization process on the plastic main body to deposit a thin metal film thereon; performing a photoresist coating process to form a photoresist protective layer on the thin metal film; performing an exposure and development process on the photoresist protective layer to form a patterned photoresist protective layer; performing an etching process on the exposed thin metal film to form a patterned metal circuit layer; stripping the patterned photoresist protective layer; and performing a surface treatment on the patterned metal circuit layer to form a metal protective layer. With the method, a 3D circuit pattern can be directly formed on a 3D plastic main body without providing additional circuit carrier to thereby meet the requirement for miniaturized and compact electronic devices.