The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Oct. 10, 2008
Klaus Weinmann, Gersthofen, DE;
Philipp Hortmann, Augsburg, DE;
Klaus Weinmann, Gersthofen, DE;
Philipp Hortmann, Augsburg, DE;
GE Intelligent Platforms Embedded Systems, Inc., Charlottesville, VA (US);
Abstract
The present invention relates to a cooling device improving the heat transfer between a chip () having a semiconducting substrate () and a heat sink (). The gap between a surface () of the chip () to be cooled and a surface () of the heat sink (), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface () of the heat sink, in order to create a wedge-shaped gap. A wedge element () having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface () to be cooled and the heat sink surface (). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.