The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jun. 21, 2011
Ashok V. Krishnamoorthy, San Diego, CA (US);
Craig A. Stephen, San Francisco, CA (US);
John E. Cunningham, San Diego, CA (US);
James G. Mitchell, Palo Alto, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
Craig A. Stephen, San Francisco, CA (US);
John E. Cunningham, San Diego, CA (US);
James G. Mitchell, Palo Alto, CA (US);
Oracle International Corporation, Redwood Shores, CA (US);
Abstract
A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.