The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jul. 19, 2011
Meng-chi Huang, Kaohsiung, TW;
Han-ping Yang, Hsinchu, TW;
Min-chieh Chou, Taipei, TW;
Tune-hune Kao, Hsinchu, TW;
Jung-kang Peng, Hsinchu County, TW;
Cheng-hsuan Lin, Taoyuan County, TW;
Jian-shian Lin, Yilan County, TW;
Meng-Chi Huang, Kaohsiung, TW;
Han-Ping Yang, Hsinchu, TW;
Min-Chieh Chou, Taipei, TW;
Tune-Hune Kao, Hsinchu, TW;
Jung-Kang Peng, Hsinchu County, TW;
Cheng-Hsuan Lin, Taoyuan County, TW;
Jian-Shian Lin, Yilan County, TW;
Industrial Technology Research Institute, Hsin-Chu, TW;
Abstract
A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.