The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jun. 04, 2009
Takao Mitsui, Chiyoda-ku, JP;
Hiroyuki Yoshihara, Chiyoda-ku, JP;
Toru Kimura, Chiyoda-ku, JP;
Masao Kikuchi, Chiyoda-ku, JP;
Yoichi Goto, Chiyoda-ku, JP;
Takao Mitsui, Chiyoda-ku, JP;
Hiroyuki Yoshihara, Chiyoda-ku, JP;
Toru Kimura, Chiyoda-ku, JP;
Masao Kikuchi, Chiyoda-ku, JP;
Yoichi Goto, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Abstract
A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.