The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jul. 27, 2012
Applicant:
Azuma Araya, Kanagawa, JP;
Inventor:
Azuma Araya, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device in which a flip chip is mounted which can change a potential of a specific terminal without changing a design of a package external. The semiconductor device includes an IC chip having a bump for an external terminal, and a package in which the IC chip is mounted. The package includes an inner lead portion that supplies a first signal or a second signal to the external terminal. The inner lead portion has a pattern of an inner lead that can change a signal to be supplied to the external terminal to the first signal or the second signal according to a position at which the IC chip is mounted.