The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Feb. 25, 2010
Sunpil Youn, Seoul, KR;
Kwanyoung OH, Suwon-si, KR;
Sunpil Youn, Seoul, KR;
Kwanyoung Oh, Suwon-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A memory module includes a first multichip package including a first master chip and a first plurality of slave chips, and a second multichip package, the second multichip package including a second master chip and a second plurality of slave chips. A first through via passes through the first master chip and electrically connects to the first master chip to provide a supply voltage to the first master chip. A second through via passes through the first master chip without being electrically connected to provide a supply voltage to the first master chip. A first set of additional through vias pass through respective ones of the first plurality of slave chips and electrically connect to the respective ones of the first plurality of slave chips, wherein the second through via and first set of additional through vias are aligned to form a first stack of through vias.