The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Sep. 25, 2009
Ji Yun Kim, Gyeonggi-do, KR;
Hyun Sub Shin, Daegu, KR;
Sung Won Lee, Seoul, KR;
Hyung Eui Lee, Gyeonggi-do, KR;
Yeong Uk Seo, Gyeonggi-do, KR;
Sung Wuk Ryu, Seoul, KR;
Hyuk Soo Lee, Gyeonggi-do, KR;
Ji Yun Kim, Gyeonggi-do, KR;
Hyun Sub Shin, Daegu, KR;
Sung Won Lee, Seoul, KR;
Hyung Eui Lee, Gyeonggi-do, KR;
Yeong Uk Seo, Gyeonggi-do, KR;
Sung Wuk Ryu, Seoul, KR;
Hyuk Soo Lee, Gyeonggi-do, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.