The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Apr. 26, 2011
Yusuke Takagi, Hitachinaka, JP;
Kaoru Uchiyama, Hitachiomiya, JP;
Tokihito Suwa, Hitachinaka, JP;
Kinya Nakatsu, Hitachinaka, JP;
Takeshi Tokuyama, Hitachi, JP;
Shinji Hiramitsu, Kashiwa, JP;
Yusuke Takagi, Hitachinaka, JP;
Kaoru Uchiyama, Hitachiomiya, JP;
Tokihito Suwa, Hitachinaka, JP;
Kinya Nakatsu, Hitachinaka, JP;
Takeshi Tokuyama, Hitachi, JP;
Shinji Hiramitsu, Kashiwa, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.