The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2014

Filed:

Oct. 07, 2011
Applicants:

Kiyoko Yamanaka, Tachikawa, JP;

Kengo Suzuki, Hitachinaka, JP;

Kazunori Ohta, Hitachinaka, JP;

Heewon Jeong, Tokyo, JP;

Masahide Hayashi, Mito, JP;

Inventors:

Kiyoko Yamanaka, Tachikawa, JP;

Kengo Suzuki, Hitachinaka, JP;

Kazunori Ohta, Hitachinaka, JP;

Heewon Jeong, Tokyo, JP;

Masahide Hayashi, Mito, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); G01L 9/00 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure () is provided in the inertial sensor device, between a semiconductor chip () mounted on a package substrate and a semiconductor chip () comprising a sensor detection part. The anti-vibration structure () has a structure in which the periphery of an anti-vibration part () is surrounded by an anti-vibration part () comprising a material having a larger Young's modulus.


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