The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Mar. 23, 2011
Shinnosuke Maeda, Nagoya, JP;
Tatsuya Ito, Kakamiganhara, JP;
Satoshi Hirano, Chita-gun, JP;
NGK Spark Plug Co., Ltd., Nagoya, JP;
Abstract
In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening.