The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Mar. 08, 2012
Koichi Inoue, Ibaraki, JP;
Miki Morita, Ibaraki, JP;
Yuichiro Shishido, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention aims to provides a method of manufacturing a film for a semiconductor device in which a dicing film, a die bond film, and a protecting film are laminated in this order, including the steps of: irradiating the die bond film with a light ray having a wavelength of 400 to 800 nm to detect the position of the die bond film based on the obtained light transmittance and punching the dicing film out based on the detected position of the die bond film, and in which T/Tis 0.04 or more, wherein Tis the light transmittance of the portion where the dicing film and the protecting film are laminated and Tis the light transmittance of the portion where the dicing film, the die bond film, and the protecting film are laminated.