The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jul. 17, 2012
Yuan-chen Liang, Tao Yuan Hsien, TW;
Chia-hui Wu, Dalin Township, Chiayi County, TW;
Hung-ta Lee, Taoyuan, TW;
Yi-chun Lin, New Taipei, TW;
Li-chuan Chien, New Taipei, TW;
Kuo-hsiang Hsu, Hukou Township, Hsinchu County, TW;
Yuan-Chen Liang, Tao Yuan Hsien, TW;
Chia-Hui Wu, Dalin Township, Chiayi County, TW;
Hung-Ta Lee, Taoyuan, TW;
Yi-Chun Lin, New Taipei, TW;
Li-Chuan Chien, New Taipei, TW;
Kuo-Hsiang Hsu, Hukou Township, Hsinchu County, TW;
Quanta Computer, Inc., Tao Yuan Hsien, TW;
Abstract
The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.