The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Jan. 18, 2011
David Graham, Lexington, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Richard D. Wells, Westerville, OH (US);
Joel Provence, Delaware, OH (US);
David Graham, Lexington, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Richard D. Wells, Westerville, OH (US);
Joel Provence, Delaware, OH (US);
Funai Electric Co., Ltd., Osaka, JP;
Abstract
A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.