The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Feb. 19, 2010
Yoshihisa Tange, Chiba, JP;
Yoshihisa Tange, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
The invention provides a manufacturing method of a glass-sealed package, and a glass substrate used for the glass-sealed package, whereby an amount of warp in a glass substrate is reduced to improve processing accuracy in a subsequent step in which the glass substrate is combined (such as by anodic bonding) with another glass substrate provided with a thin film. The front side of the glass substrate includes a region where the cavities used to house electronic devices such as semiconductor IC chips and crystal blanks are not formed. The region devoid of the cavities is provided in the formed of a frame to reduce an amount of warp in the glass substrate.