The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Sep. 21, 2009
Applicants:
Makoto Murai, Gifu, JP;
Yasuhiro Kohara, Gifu, JP;
Ryosuke Usui, Aichi, JP;
Inventors:
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.