The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

May. 28, 2010
Applicants:

Atsushi Saito, Isesaki, JP;

Makoto Shibuya, Isesaki, JP;

Kouki Yoshizawa, Isesaki, JP;

Hideo Ikeda, Isesaki, JP;

Inventors:

Atsushi Saito, Isesaki, JP;

Makoto Shibuya, Isesaki, JP;

Kouki Yoshizawa, Isesaki, JP;

Hideo Ikeda, Isesaki, JP;

Assignee:

Sanden Corporation, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 1/00 (2006.01); F04C 18/02 (2006.01); H02K 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an inverter-integrated electric compressor having high heat resistance, which is capable of suppressing thermal interference among a plurality of power devices. Specifically provided is an inverter-integrated electric compressor which comprises a built-in motor and a substrate provided with a motor drive circuit including an inverter, an electric component including the substrate being affixed in a housing space surrounded by a compressor housing, wherein a plurality of power semiconductor elements which constitute the motor drive circuit are disposed radially around a drive shaft of the motor in a plane crossing the drive shaft. For example, the planar shape of the power semiconductor element is formed into a rectangle, and a gap having a sectorial planar shape is formed between the power semiconductor elements adjacent to each other.


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