The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Aug. 24, 2010
Takeshi Tokuyama, Hitachi, JP;
Kinya Nakatsu, Hitachinaka, JP;
Ryuichi Saito, Hitachi, JP;
Toshiya Satoh, Hitachiota, JP;
Hideaki Ishikawa, Mito, JP;
Nobutake Tsuyuno, Naka-gun, JP;
Shigeo Amagi, Naka-gun, JP;
Takeshi Tokuyama, Hitachi, JP;
Kinya Nakatsu, Hitachinaka, JP;
Ryuichi Saito, Hitachi, JP;
Toshiya Satoh, Hitachiota, JP;
Hideaki Ishikawa, Mito, JP;
Nobutake Tsuyuno, Naka-gun, JP;
Shigeo Amagi, Naka-gun, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.