The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

Feb. 05, 2010
Applicants:

Kyung-man Kim, Hwaseong-si, KR;

In-sang Song, Seoul, KR;

Inventors:

Kyung-man Kim, Hwaseong-si, KR;

In-sang Song, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a first semiconductor package having at least one first semiconductor chip and a first sealing member covering the at least one first semiconductor chip. The semiconductor device also includes a second semiconductor package stacked on the first semiconductor package. The second semiconductor package has at least one second semiconductor chip, leads electrically connected to the at least one second semiconductor chip, and a second sealing member covering the at least one second semiconductor chip. At least one signal connection member is disposed in the first sealing member of the first semiconductor package. The at least one signal connection member electrically connects the at least one first semiconductor chip with the leads of the at least one second semiconductor chip.


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