The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

Aug. 22, 2007
Applicants:

Kazuo Okada, Ota, JP;

Katsuhiko Kitagawa, Ota, JP;

Hiroshi Yamada, Ebina, JP;

Inventors:

Kazuo Okada, Ota, JP;

Katsuhiko Kitagawa, Ota, JP;

Hiroshi Yamada, Ebina, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A device elementis formed on a front surface of a semiconductor substrateand a sealing bodyis attached to the semiconductor substratewith an adhesive layerbeing interposed therebetween. A main surface (a back surface) of the sealing bodywhich faces the semiconductor substrateis curved inward, and there is a given space (a cavity) between the sealing bodyand the semiconductor substrateSince the back surface of the sealing bodyis curved, the sealing bodyis used as a planoconcave lens (a reverse direction) as well as a sealing member for the device element


Find Patent Forward Citations

Loading…