The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

Sep. 28, 2009
Applicants:

Linda M. Van Den Bossche, Zwijndrecht, BE;

Nancy G. Vogelaers, Leefdaal, BE;

Jean-marc C. Dekoninck, Hamme-Mille, BE;

Arnaud F. Alabrune, Sandweiler, LU;

Michael E. Sieloff, Houston, TX (US);

Bernard K. Beh, Singapore, SG;

Inventors:

Linda M. Van Den Bossche, Zwijndrecht, BE;

Nancy G. Vogelaers, Leefdaal, BE;

Jean-Marc C. Dekoninck, Hamme-Mille, BE;

Arnaud F. Alabrune, Sandweiler, LU;

Michael E. Sieloff, Houston, TX (US);

Bernard K. Beh, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/00 (2006.01); C08L 23/04 (2006.01); B05D 1/36 (2006.01); B05D 7/00 (2006.01); B32B 15/08 (2006.01); B32B 23/08 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polymeric composition that is suitable for use as a film or a coating. The polymeric composition comprises: (a) a first component comprising copolymer derived from ethylene and one or more Cto Cα-olefin comonomers. The first component has a density of about 0.911 to about 0.918 g/cm, a compositional distribution breadth index (CDBI) of about 60% to about 85%, a melt index (MI) of about 16.0 to about 30.0 g/10 min, a molecular weight distribution (MWD) of about 1.5 to about 4.0, and a melt index ratio (MIR) of less than about 25; and (b) a second component comprising a low density polyethylene (LDPE). The second component has a g' of about 0.8 to about 0.15 and a MI that is lower than the MI of the first component.


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