The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

May. 08, 2008
Applicants:

Tatsuya Toneri, Tokyo, JP;

Masaaki Mawatari, Tokyo, JP;

Inventors:

Tatsuya Toneri, Tokyo, JP;

Masaaki Mawatari, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 51/06 (2006.01); C08L 67/00 (2006.01); C08L 67/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The object of the present invention is to provide a thermoplastic polymer composition which is excellent in the impact resistance, a fracture morphology and rigidity, as well as has a possibility of the effect for reducing environmental load. The thermoplastic resin composition comprises 15 to 85% by mass of aliphatic polyester-based resin (A) comprising the following (AI) and (AII) components, and The above (AI) is an aliphatic polyester-based resin having units formed from an aliphatic diol and/or an alicyclic diol and an aliphatic dicarboxylic acid (including derivatives thereof) and/or an alicyclic dicarboxylic (including derivatives thereof) as repeating units, and the above (AII) is a polylactic acid-based aliphatic polyester resin having not less than 70 mol % of lactic acid unit content. The above (BI) is a graft copolymer obtained by polymerizing vinyl-based monomers (b2) comprising an aromatic vinyl compound and another vinyl compound copolymerizable therewith in the presence of rubber polymer (b1), the above (BII) is a polymer of vinyl-based monomers (b2), and the above (BIII) is a mixture of said (BI) and (BII).


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