The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Sep. 19, 2008
Kazuo Ono, Ichihara, JP;
Masami Kaneko, Ichihara, JP;
Natsuki Amanokura, Ichihara, JP;
Nippon Soda Co., Ltd., Tokyo, JP;
Abstract
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C-Calkyl group, phenyl group, benzyl group or cyanoethyl group, and Rto Rrepresent a hydrogen atom, nitro group, halogen atom, C-Calkyl group, phenyl group, benzyl group, hydroxymethyl group or C-Cacyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.