The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

Aug. 07, 2006
Applicants:

Martin Fluegge, Wiesbaden, DE;

Raimund Mellies, Dieburg, DE;

Thomas Goelzenleuchter, Buettelborn, DE;

Marianne Schwager, Weiterstadt, DE;

Ruediger Oesten, Frankenthal, DE;

Inventors:

Martin Fluegge, Wiesbaden, DE;

Raimund Mellies, Dieburg, DE;

Thomas Goelzenleuchter, Buettelborn, DE;

Marianne Schwager, Weiterstadt, DE;

Ruediger Oesten, Frankenthal, DE;

Assignee:

BASF Aktiengesellschaft, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to new storage-stable solutions which can be used in semiconductor technology to effect specific etching of copper metallization layers and also Cu/Ni layers. With the new etch solutions it is possible to carry out etching and patterning of all-copper metallizations, layers of copper/nickel alloys, and also successive copper and nickel layers.


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