The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Apr. 12, 2012
Applicants:
Eon-jo Byun, Yongin-si, KR;
Yang-gi Kim, Gyeonggi-do, KR;
Inventors:
Eon-Jo Byun, Yongin-si, KR;
Yang-Gi Kim, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip testing method includes cutting a wafer into chip packages, re-arranging the chip packages on a chip tray, and testing the re-arranged chip packages. The wafer includes a plurality of substrates vertically stacked thereon, and each of the plurality of substrates has a plurality of chips mounted thereon.
Byun, Eon-Jo. (2014). Chip testing method (U.S. Patent No. 8652858). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8652858
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile