The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Dec. 07, 2010
Dae Hyun Kim, Ulsan, KR;
Dong Woo Lee, Incheon, KR;
IN Dal Kim, Anyang-si, KR;
Sang Young Choi, Seoul, KR;
Ji Hoon Lee, Ulsan, KR;
BO Min Jeon, Ulsan, KR;
Dae Hyun Kim, Ulsan, KR;
Dong Woo Lee, Incheon, KR;
In Dal Kim, Anyang-si, KR;
Sang Young Choi, Seoul, KR;
Ji Hoon Lee, Ulsan, KR;
Bo Min Jeon, Ulsan, KR;
Poonsgan Corporation, Seoul, KR;
Abstract
A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability without negatively affecting the tensile strength. The copper alloy contains 0.2 to 0.4 wt % of Cr, 0.05 to 0.15 wt % of Sn, 0.05 to 0.15 wt % of Zn, 0.01 to 0.30 wt % of Mg, 0.03 to 0.07 wt % of Si, with the remainder being Cu and inevitable impurities. A method for manufacturing the copper alloy includes obtaining a molten metal having the described composition; obtaining an ingot; heating the ingot at a temperature of 900-1000° C. to perform a hot rolling process; cold rolling; performing a first aging process at a temperature of 400-500° C. for 2 to 8 hours; cold rolling; and performing a second aging process at a temperature of 370-450° C. for 2 to 8 hours.