The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2014

Filed:

Jun. 08, 2012
Applicants:

Adam Ahmad Barzak, Anaheim, CA (US);

Andrew John Mckenzie, Long Beach, CA (US);

David Mark Ambler, Ranchos Palos Verdes, CA (US);

Inventors:

Adam Ahmad Barzak, Anaheim, CA (US);

Andrew John McKenzie, Long Beach, CA (US);

David Mark Ambler, Ranchos Palos Verdes, CA (US);

Assignee:

Younger MFG. Co., Torrance, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02C 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention describes ophthalmic lens products comprising a multilayer wafer and an injection-molded polycarbonate inner portion. The multilayer wafer includes a dyed, photochromic or polarized layer between a tinted inner layer and an outer polymeric layer. The inner layer may be solid or gradient-tinted. The polycarbonate inner portion of the lens product is directly fused to the tinted inner layer of the multilayer wafer during injection molding. The invention further describes a method to produce a gradient-tinted polarized polycarbonate eyewear lens product by obtaining a multilayer wafer having an outer layer, an inner polycarbonate layer, and a polarized layer between the inner and outer layers, applying a gradient tint to the wafer's inner layer, placing the gradient tinted wafer within an injection-molding cavity, and injecting molten polycarbonate directly against the wafer's gradient-tinted layer to form the inner portion of the lens product and to fuse it to the wafer.


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