The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2014

Filed:

Feb. 06, 2009
Applicants:

Fuminori Tanaka, Osaka, JP;

Ryusuke Horibe, Osaka, JP;

Takeshi Inoda, Osaka, JP;

Rikuo Takano, Ibaraki, JP;

Kiyoshi Sugiyama, Tokyo, JP;

Toshimi Fukuoka, Kanagawa, JP;

Masatoshi Ono, Ibaraki, JP;

Inventors:

Fuminori Tanaka, Osaka, JP;

Ryusuke Horibe, Osaka, JP;

Takeshi Inoda, Osaka, JP;

Rikuo Takano, Ibaraki, JP;

Kiyoshi Sugiyama, Tokyo, JP;

Toshimi Fukuoka, Kanagawa, JP;

Masatoshi Ono, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a downsized microphone unit in which a differential microphone is densely mounted thereon. The microphone unit has a cover portionand a microphone substrate, in which a first substrate internal spaceis communicated with a cover portion internal spacevia a first substrate openingand a cover portion opening, and is communicated with the outside via a second substrate opening, a second substrate internal spaceis communicated with the cover portion internal spacevia a third substrate openingand a cover portion opening, and is communicated with the outside via a fourth substrate opening, a partition portioncovers a communication aperture between the first substrate openingand the cover portion opening, and a diaphragmcovers at least a part of the communication aperture between the first substrate openingand the cover portion opening


Find Patent Forward Citations

Loading…