The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Jun. 02, 2009
Matthias Schröder, Stadtroda, DE;
Dirk Lorenzen, Fürstenberg, DE;
Matthias Schröder, Stadtroda, DE;
Dirk Lorenzen, Fürstenberg, DE;
Jenoptik Laser GmbH, Jena, DE;
Abstract
A semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat conducting body each. The heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element. A spacer, which with regard to the third connection, is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the joining zone thickness of the third connection being greater than that of the first or the second joining zone to ensure that defined joining zone thicknesses in the bonded connection is maintained during the joining process. The third connection can be used for at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device.