The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Nov. 12, 2010
Ching-yuan Huang, Taipei, TW;
Chang-yuan Wu, Taipei, TW;
I-feng Hsu, Taipei, TW;
Tzu-chang Chen, Taipei, TW;
Ching-Yuan Huang, Taipei, TW;
Chang-Yuan Wu, Taipei, TW;
I-Feng Hsu, Taipei, TW;
Tzu-Chang Chen, Taipei, TW;
Compal Electronics, Inc., Taipei, TW;
Abstract
A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure.