The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
May. 17, 2010
Hiren D. Thacker, San Diego, CA (US);
Jing Shi, Carlsbad, CA (US);
John E. Cunningham, San Diego, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
Hiren D. Thacker, San Diego, CA (US);
Jing Shi, Carlsbad, CA (US);
John E. Cunningham, San Diego, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
Oracle International Corporation, Redwood Shores, CA (US);
Abstract
A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.