The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2014

Filed:

Mar. 30, 2011
Applicants:

Takahiro Ooi, Kawasaki, JP;

Yoshihiro Morita, Kawasaki, JP;

Akiko Matsui, Kawasaki, JP;

Tetsuro Yamada, Kawasaki, JP;

Mitsuhiko Sugane, Kawasaki, JP;

Takahide Mukoyama, Kawasaki, JP;

Inventors:

Takahiro Ooi, Kawasaki, JP;

Yoshihiro Morita, Kawasaki, JP;

Akiko Matsui, Kawasaki, JP;

Tetsuro Yamada, Kawasaki, JP;

Mitsuhiko Sugane, Kawasaki, JP;

Takahide Mukoyama, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 7/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.


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