The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Aug. 04, 2011
Jens Frey, Filderstadt, DE;
Heribert Weber, Nuertingen, DE;
Eckhard Graf, Gomaringen, DE;
Roman Schlosser, Waldkirch, DE;
Jens Frey, Filderstadt, DE;
Heribert Weber, Nuertingen, DE;
Eckhard Graf, Gomaringen, DE;
Roman Schlosser, Waldkirch, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method.